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XR806芯片介绍

简介

XR806是全志科技旗下子公司广州芯之联研发设计的一款支持WiFi和BLE的高集成度无线MCU芯片,支持鸿蒙L0系统。具有集成度高、硬件设计简单、BOM成本低、安全可靠等优点。可广泛满足 智能家居、智慧楼宇、工业互联、儿童玩具、电子竞赛、极客DIY 等领域的无线连接需求。

XR806chipblack

参数规格

CPU

Arm-Star ARMv8-M MCU, up to 160MHz

DDR

288KB SRAM

Memory

160KB Code ROM. SIP  16Mbit Flash.

eFuse

1024 bits. It can be uesd to write WiFi/BT MAC address, Chip ID,security KEY and so on.

WiFi

- Compatible with 802.11b/g/n standard

- Single-band 2.4G 1T1R WLAN

- WPA/WPA2.0 personal/WPA3.0 personal/ WPS2.0

- Integrated LNA PA and T/R switch

- STA, AP, STA/AP and Monitor mode

- Supports Wi-Fi and Bluetooth Co-existence

BLE

- Bluetooth Low Energy V5.0 1Mbps, 2Mbps and long range

- -97dBm RX sensitivity in 1Mbps mode

- -103dBm RX sensitivity in 125kbps mode

- TX power: -20dBm ~ 20dBm

Security

- TEE: TrustZone-M 

- Secure boot (ECC)

- Secure memory/eFuse

- JTAG/SWD protection

- Flash encryption/decryption

- HW crypto engine(AES/DES/3DES/MD5/SHA/SHA256/TRNG)

Power Management

- 1.62 ~ 5.5V single power supply integrated with DC-DC

- Shutdown: 0.5uA

- Hibernation: 5uA@RTC only

- Standby: 28uA@16KB SRAM retention

- WLAN DTIM interval with 32.768kHz XTAL:580uA@DTIM1, 230uA@DTIM3, 90uA@DTIM10

- WLAN RX active: 20mA@11b 1M Beacon

- WLAN TX active: 180mA@16dBm, 85mA@10dBm

Package

QFN32 4mm x 4mm

Chip process

40nm

芯片框图

image-20210913105330666

*注:本文档所提及XR806芯片及开发板特指XR806AF2L型号